News | Epec

[Bells, TN and New Bedford, MA: November 30, 2007]   Volunteer Circuits, Inc. and Epec, LLC shared today that they have joined together to give customers a greater range of high quality products and services... Entire story

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[New Bedford, MA: September 20, 2007] – JP Hansen, Epec’s Technical and Software Engineering Manager, proudly shared, “ EpecDFx™ is a whole new quality and manufacturability solution, combining the industry’s latest, most advanced technology and unparalleled engineering expertise.”

Epec developed the new platform because front end processes are where most PCB mistakes happen. Mistakes that can be devastating in today’s world of lean manufacturing, innovation, and continually shortening product life cycles.

“Based on our research and collaboration with our customers, we are confident our new EpecDFx™ solution will help customers get to market faster, with higher quality standards, at a lower overall cost,” shared Ed McMahon, CEO of Epec

The technology is one of several investment initiatives focused on making it easier for our customers to save time and money.

Experience Epec DFx™, and how our engineering support gives customers the most in-depth feedback, with exact accuracy, available anywhere in the printed circuit board Industry, eliminating delays and quality problems. Download Epec DFx Overview (491kB)

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Epec is pleased to share the hiring of two key leadership positions, with John Stabers becoming the Executive Vice President of Sales and Dan O’Hara the Quality Director.

John is a recognized leader in the PCB industry, with extensive experience in building world class field sales and service teams.

John’s most recent position was as SVP - Business Development for Sanmina SCI’s PCB Division, one of the largest PCB Companies in the world, where he successfully reinvigorated and refocused the entire organization. Prior to Sanmina, John held Sales leadership positions at Teradyne High performance Printed Circuit Boards, Westwood Associates, and Hadco Corporation.

“John’s proven experiences in PCB sales and customer growth initiatives ideally position him to lead Epec’s long term business development, focused on value added PCB solutions,” shared Greg Klein, Chairman of Epec.

Dan joins Epec with over twenty-years of experience driving world class quality organizations in the commercial, medical, and defense industries. His in depth process, engineering and technical knowledge, coupled with his global operational expertise, have uniquely prepared him to lead Epec’s worldwide quality operations to new levels of Customer Satisfaction and Technical Excellence.

Dan’s in depth process, engineering and technical knowledge, coupled with his global operational expertise, have uniquely prepared him to lead Epec’s worldwide quality operations to new levels of Customer Satisfaction and Technical Excellence”, stated Greg Klein, Chairman of Epec.

Prior to joining Epec, Dan was the Quality Manager at Northrop Grumman’s Military Defense manufacturing facility in Canton MA. Before Northrop, Dan was the Quality Manager at Smith & Nephew Endoscopy, a global medical device manufacturer, where he led process improvement initiatives utilizing Six Sigma process and managed the successful transition to manufacturing in more cost efficient facilities in Asia. He also held engineering and quality management positions at Stanley Bostitch and Advanced Interconnect. Dan received his B.S. Degree in Industrial Technology at Rhode Island College, is an ISO ANSI/RAB Lead Auditor Certified.

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[Elk Grove, IL & New Bedford, MA: December 26, 2006] - We are very pleased to announce that the Tingstol Company has joined together with Epec LLC, in order to secure and continue to offer our valued customers the highest quality printed circuit boards, “On time all the time.”...Entire story

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Epec is proud to announce that Rob Forand has been hired as the Information Technology Director and Hayes Myers as Engineering Manager, two key steps forward in continuing to grow the Company’s leadership team.

Rob is a proven executive with fifteen years of expertise in IT infrastructure and global enterprise technology solutions. Rob will be leading the implementation of Epec’s new “end-to-end” technology platform which will continue to support the growth initiatives that reduce delivery times and improve global performance.

Before joining Epec, Rob managed the IT operations of several large international companies including Ahead Headgear, the global leader in golf apparel and Edwards & Angell, LLP, a $500 Million, multi-office law firm headquartered in Providence, RI. In these positions he was a key leader in architecting infrastructure solutions, data center build-outs, implementing improved technology platforms and technology integrations for acquisitions. He received his B.S. Degree in Computer Science from The University of Massachusetts.

Hayes Myers brings over ten years of experience in the PCB industry to the Epec team. He has served in a variety of roles, starting with the development and hands-on implementation of a Prototype Manufacturing division through Senior Front End Engineering roles at Viasystems, Tyco and Coretec.

As Engineering Manager, Hayes is focused on leading Epec engineering enhancement and technology improvement programs, which are helping reduce our customer’s time-to-market.

Hayes’ manufacturing experience lends detailed knowledge of all manufacturing processes, from the tooling of customer parts to running every process through to Pack and Ship! This strong operational background along with his Bachelor of Engineering Science degree in Electrical Engineering from the University of Western Ontario in London, Ontario and Post-Graduate Studies at Wilfrid Laurier University in Waterloo,Ontario (Diploma of Graduate Business Studies) allows Hayes to balance real world manufacturing concerns with the logistical and technological challenges faced by Epec’s customers. Hayes is a Professional Engineer with membership in the Association of Professional Engineers of Ontario.

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Since Epec is now supplying our customers, both domestically and internationally, with UL approved, RoHS compliant, lead-free printed circuit boards, we are highlighting Epec News with the following facts about RoHS Compliance, as provided by the IPC, the Association Connecting Electronics Industries, Isola Laminates, Polyclad laminates, and EIA/Joint Industry Guide (JIG). Epec’s Account Team is actively assisting partners and clients by sharing information and analyzing the options that are best for each specific application.  Read RoHS Facts...Click here

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After evaluating several strategies to improve testing efficiency, Epec has just completed the installation of a state-of-the-art MicroCraft test system.

The system will significantly enhance Epec's testing capabilities and upgrade key quality systems, because of the depth and best-in-class features of the MicroCraft. The system includes a Full Resistance and Phase Difference Measurements (PDM), Buried Resistors and Capacitors, HiPOT (military and telecom applications), 2D Cavitiy Testing, Verification and Retest via BAR CODE (No human typing mistakes), Large Format 24 x 30, and Pneumatic Clamp and Servo Tensioning system for Thin and Flex material testing.

Epec is confident that the MicroCraft will continue to improve quality while reducing cycle times.

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[Holden, MA and New Bedford, MA: February 8, 2005] - ECC and Epec LLC announced, today, the two companies are joining forces to give customers a greater range of high quality printed circuit board services and long term financial strength... Entire story

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Further enhancing Epec's Multi-Layer capabilities, Epec has purchased a Mania Probot Electrical Tester and an Electroless Nickel Immersion Gold line.

Mania Probot Electrical Tester

We have recently completed the installation of an additional Probot "flying probe" electrical testing machine.  This machine further increases our capacity to test high density printed circuits with fine lines and tight spaces and circuits requiring double-sided testing.  Increasing demand for "Quick-Turn" work has necessitated the increased capacity to maintain our "on-time, every time" customer focus.

Electroless Nickel Immersion Gold

We have acquired a twenty-four step electroless nickel-immersion gold process line to augment the surface finishes we currently provide in-house.  This new system will incorporate Technic's TECHNIPAD SMT System which provides an improved electroless nickel/immersion gold (ENIG) process that has been specifically developed to meet the challenges of selective plating of printed circuit board features.  The TECHNIPAD SMT System incorporates a mid-phosphorous electroless nickel (8-10% w/w) with a non-porous immersion gold.  The TECHNIPAD SMT System meets all the requirements for solderability and wire bondability applicable to a thin (3-8 m") gold deposits.

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Epec continues to achieve consistently high on-time delivery performance from its recently reconfigured, more flexible, quick-turn facility in New Bedford. November's premium on-time, "first-time-right," delivery remained above the 94% benchmark, at 95.3% for the month.

"Our primary focus is on-time, first-time-right delivery and it is how we measure success. So we're pleased with the results because we have learned from our customers that today's 'just-in-time' marketplace demands consistent, on-time delivery," says Bob St. Onge, Director of Operations.

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After a year of successfully implementing several operational enhancement projects and installing new equipment throughout our New Bedford facility, Epec's premium on time, "first-time-right," delivery increased to 94.6% for the month of April.

We recognize in today's competitive marketplace, our customers most critical decision factor in selecting a PCB resource is on-time delivery with first-time-right quality, from prototype through production.

Epec is proud to have improved the delivery rate, which will continue to help our customers improve their competitiveness in the market place. "Our commitment to increasing quick turn and prototype capacity and capabilities for both double-sided and multi-layer boards are my primary focus," stated Bob St. Onge, Operations Manager. "And we are very proud of our team's on-time delivery rate without sacrificing quality. Our goal is to make it right the first time, every time."

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Epec is pleased to have completed the acquisition of the business of Gultech North Carolina, Inc, a manufacturer of prototype, multi-layer printed circuit boards.

Gultech is a successful manufacturer of quick-turn prototype, multi-layer printed circuit board solutions to leading companies in the medical, aerospace, transportation and industrial control sectors.

"The acquisition of Gultech North Carolina is a strong geographic and technological fit for Epec's focused, long-term growth plan. We are particularly excited by Gultech's exceptional engineering and service teams which are now in place to support the customer's prototype through production needs," said Ed McMahon, President & CEO of Epec, LLC.

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Epec has further planned for its future with the acquisition of new equipment and the implementation of a new electronic data management system.

After an extensive review of the requirements to further improve our capabilities and lower our costs, we recently completed our largest capital equipment acquisition plan in the Company's fifty-two year history, which will help ensure our customer commitment of delivering quality. Key pieces of equipment already installed include:

Atotech XLi Resist Strip/Alkaline Etch System

In today's world of high density printed circuit boards with fine lines and tight spacing, perfect stripping of photo-resist coupled with unsurpassed uniformity of the etching process, from side to side, leading to trailing edge and top to bottom of every panel is absolutely critical for the consistent production of the highest quality printed circuits. To assure this level of quality for our customers we have just completed the installation of a Atotech XLi Alkaline Etch/Resist Strip System. Atotech's renowned design and fabrication expertise combined with Epec's process control techniques ensure our customers the very best line resolution and greatest uniformity available.

Chemcut XLi Bond Film Application System

Quality multi-layer boards require superior bonding of all layers. Epec's recently installed Chemcut XLi Bond Film Application system is the most technologically advanced "alternative oxide" available. The utilization of this system provides our customers with the assurance that their boards will exhibit superior bonding qualities and meet or exceed MIL-P-55110D thermal stress testing and all other industry accepted performance testing.

Wessel Multi-Layer Pro System 1

Our recent addition of a Wessel Pro System 1 High Speed Drilling and Routing machine is equipped with "Multi-layer Vision" system to assure optimum hole location on multi-layer boards. Other capabilities of this machine include high accuracy drilling of very small hole diameters (capable of drilling .004" dia. Holes) and precision controlled depth drilling and milling. Unlike other drilling or routing machines the Wessel drill automatically measures the drill penetration from the top surface of the board to assure repeatable and precise depth every time.

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As many of the new high-performance electrical products require improved reliability under extreme conditions, heavy copper circuit boards are becoming the preferred method of making an ordinary circuit into a durable and dependable wiring platform.

A few of the advantages of using heavy copper are increased mechanical strength, added current carrying capacity, additional thermal stress resistance and decreased heat generation.

Here at Epec we have significant experience and expertise in manufacturing multi-layer boards up to 12-layers with 5-ounce inner layer copper and up to 8-ounce outer layer copper. Boards of this nature require that many additional factors be considered prior to fabrication, such as in hole plating thickness and line width and spacing and method of applying solder mask, when required.

Our experience will ensure that you get the correct heavy copper board the first time. Let us put our knowledge to work for you. Our engineering team is always available to work with our customers design team to make sure that your heavy copper designs are manufacturable for prototypes and production.

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