| |
Current |
Future |
| Maximum Layers |
18 |
26 |
| Maximum Board Thickness |
.250" |
.287" |
| Copper Wt. |
|
|
| Inner Layers |
4 Ounces |
6 Ounces |
| Outer Layers |
6 Ounces |
10 Ounces |
| Minimum Line Width & Spacing |
|
|
| Inner Layers |
.0039"/.0039" |
.003"/.003" |
| Outer Layers |
.0039"/.0039" |
.003"/.003" |
| Maximum Board Size |
20" x 23" |
24" x 36 " |
| Minimum Core Thickness |
.004" |
.003" |
| Smallest Hole Size |
.006" |
.005" |
| Minimum Component Pitch |
10 mils |
8 mils |
| Aspect Ratio |
11:01 |
15:01 |
| Via Technology |
Blind, Buried & Micro |
Blind, Buried & Micro |
| Impedance Control |
+/-10% |
+/-5% |
| Surface Finishes |
HASL, Immersion Nickel/Gold,
Deep Gold, Immersion Silver, White Tin, OSP, Tin/Lead Reflow |
HASL, Immersion Nickel/Gold,
Deep Gold, Soft Gold, Immersion Silver, White Tin, OSP, Tin/Lead
Reflow |
| Materials |
FR-4, High Tg FR-4, Rogers 4000
Series, Polyimide, Teflon |
Rogers 4000 and
5000 Series, Polyimide, Teflon, Thermagon, Cynate Ester, Getek,
Mixed Dielectrics |
| Special Processes |
Plasma Etchback, Counterbore,
Countersink, Metal Core, Conductive/Non Conductive Via Plug, Heatsinks |
Plasma Etchback, Counterbore,
Countersink, Metal Core, Conductive/Non Conductive Via Plug, Heatsinks,
Imbedded Capacitance/Resistance, Laser Drilling |
